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Bundle 1:Core Board 4GB LPDDR4+32GB eMMC
Bundle 2:Core Board 8GB LPDDR4+32GB eMMC
Bundle 3:Development oard 4GB LPDDR4+32GB eMMC
Bundle 4:Development oard 8GB LPDDR4+32GB eMMC
iCore-3588JQ
8K Industrial AI Core Board
Powered by Rockchip RK3588J new-gen industrial octa-core 64-bit processor, the core board supports up to 32GB RAM and 8K video encoding and decoding. With industrial-grade SoC, precision components and BTB connector,it delivers long and stable operation between -40°C and 85°C, satisfying the industrial-grade needs.Backplane reference design and other open resources are provided for users to make further customization.
Octa-core industrial-grade processor RK3588J
Powered by Rockchip RK3588J octa-core 64-bit industrial-grade processor, its frequency is up to 2.1GHz, with 8nm lithography process. Integrated with ARM Mali-G610 MP4 quad-core GPU and built-in AI acceleration NPU, it provides 6Tops computing power and supports mainstream deep learning frameworks. There are a variety of storage options,which allows customers to quickly implement research and production.
8K video encoding and decoding
The core board supports 8K@60fps H.265/VP9 video decoding and 8K@30fps H.265/H.264 video encoding.It also supports encoding and decoding simultaneously — up to 32-channel 1080P@30fps decoding and 16-channel 1080P@30fps encoding can be achieved. The strong video encoding and decoding capability makes 8K HD display with more sharp detail available.
Super-large 32GB RAM
Up to 32GB RAM can be configured, which exceeds the limit of the previous RAM and speeds up response time. It can meet the application requirements of products with large RAM and large storage.
Multi-channel input and output
With HDMI2.1/eDP1.3/MIPI-DSI/DP1.4/BT.1120 multi-channel video output and HDMI RX2.0 / MIPI-CSI / DVP video input ports,this core board supports multi-channel 8K video output and 4K video input — up to seven-screen output with different displays can be achieved. 48MP ISP with HDR&3DNR is integrated and dual MIPI-CSI camera input provided.
Strong network communication capability
Integrated with PCIe3.0/GMAC/SDIO3.0/USB3.0, it can be extended to multi-channel Gigabit Ethernet, WiFi 6/Bluetooth,5G/4G LTE, enabling network communication with higher speed.
Multiple hard disks, massive capacity
PCIe3.0/SATA3.0 can be connected with multiple SSD/HDD mass storage devices, making it a reality that the device can be easily expanded with TB storage capacity.
Firm and tight BTB port
The core board is equipped with high-speed industrial-grade connector, with high reliability and stability. BTB port, its connection is tight and firm, which is more convenient to connect backplane.
Wide-temperature stable operation
It is equipped with industrial-grade SoC, precision components and connectors, so it can provide 7x24h continuous and stable operation in the range of -40°C~85°C, satisfying industrial-grade needs.
More interfaces for more possibilities
PCIe3.0, SATA3.0, I2S, I2C, CAN, UART, SPDIF, SDIO3.0, MIPI-CSI, MIPI-DSI, USB3.0, USB2.0, SPI, GPIO are provided.
Form an industrial mainboard with backplane
The core board can be combined with the backplane to form a complete high-performance industrial mainboard with more expansion interfaces, which can be directly applied to various industrial-grade products to accelerate the product development process.
Backplane reference design provided
Backplane reference design and complete technical information are provided, so users can efficiently proceed secondary development to quickly create independent and controllable products.
Support various operating systems
Android 12.0, Ubuntu Desktop version and Server version, Debian11 and Buildroot are supported. And it supports RTLinux,delivering excellent real-time performance.
Abundant resources
SDK, tutorials, tech docs and dev tools are provided, making development simpler and more convenient.
A wide range of applications
This core board can be widely used in ARM PC, edge computing, cloud server, smart NVR, smart video wall, AR/VR, smart car and other fields.
Basic Specifications
Basic Specifications |
|
SOC |
RockChip RK3588J |
CPU |
Octa-core 64-bit (4×Cortex-A76+4×Cortex-A55), 8nm lithography process, clock speed up to 2.1GHz |
GPU |
ARM Mali-G610 MP4 quad-core GPU Support OpenGL ES3.2 / OpenCL 2.2 / Vulkan1.1, 450 GFLOPS |
NPU |
NPU computing power up to 6 TOPS Support INT4/INT8/INT16 mixed operation Support framework switching of TensorFlow / MXNet / PyTorch / Caffe |
ISP |
Integrated 48MP ISP with HDR&3DNR |
VPU |
Video decoding: 8K@60fps H.265/VP9/AVS2 8K@30fps H.264 AVC/MVC 4K@60fps AV1 1080P@60fps MPEG-2/-1/VC-1/VP8 Video encoding: 8K@30fps encoding, support H.265 / H.264 *Up to 32-channel 1080P@30fps decoding and 16-channel 1080P@30fps encoding can be achieved. |
RAM |
4GB/8GB/16GB (Up to 32GB optional) 64bit LPDDR4/LPDDR4x(industrial grade) |
Storage |
16GB/32GB/64GB/128GB eMMC (industrial grade) |
Hardware Specifications |
|
Network |
Integrated PCIe3.0/GMAC/SDIO3.0/USB3.0, can be extended to multi-channel Gigabit Ethernet, WiFi6/Bluetooth and 5G/4G LTE |
Display |
Video output: 2×HDMI2.1 (8K@60fps or 4K@120fps, multiplexed with eDP) 2×MIPI-DSI (4K@60fps) 2×DP1.4 (8K@30fps, multiplexed with USB3.0) 1×BT.1120 (1080P@60fps) Video input: 1×HDMI-IN (4K@60fps), support HDCP 2.3 2×MIPI CSI (4 Lane) or 4×MIPI CSI (2 Lane) or 1×MIPI CSI (4 Lane) + 2×MIPI CSI (2 Lane) 2×MIPI DC (4-lane DPHY v2.0 or 3-lane CPHY V1.1) 1×DVP camera interface (up to 150MHz data input) * Support multi-channel 8K video output and 4K video input. Up to seven-screen output with different displays can be achieved. |
Audio |
2 × 8 Lane I2S 2 × 2 Lane I2S 2 × SPDIF 2 × 8 Lane PDM (support multi-Mic array) 1 × dual-channel digital audio codec (16-bit DAC) 1 × VAD |
PCIE |
PCIe3.0 (2×2lanes,1×4lanes,4×1lanes) 、3×PCIE2.0(1 lanes) |
SATA |
3 × SATA3.0 |
USB |
3 × USB3.0、4 × USB2.0 Host 2 × USB2.0 OTG |
Power |
4V (voltage tolerance±5%) |
Other Interfaces |
9×I2C, 10×UART, 5×SPI, 4×ADC , 16×PWM , 1×SDMMC and GPIO |
OS/Software |
|
OS |
Android 12.0, Ubuntu Desktop and Server, Debian11 and Buildroot RTLinux (delivering excellent real-time performance) |
General |
|
Dimension |
66 mm × 50 mm |
Weight |
≈20g |
Interface Type |
BTB connector (1×60Pin + 3×80Pin) |
Power Consumption |
Idle: 0.04W (4.0V/10mA) Typical: 1W (4.0V/250mA) Max: 12W (4.0V/3000mA) |
Environment |
Operating Temperature: -40℃~85℃ Storage Humidity: 10%~80 % |
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Shipping Choice
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Shipment
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4. We ship items to worldwide with delivery time guarantee
Contact us
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2. All emails will be answered within 1 business day. If you do not receive our reply, please kindly re-sent your email and we will reply you as soonas possible.
3. Warranty services are for replacements only, any problem please kindly email us frist, we will accept your advise & request.
Return&Refund
1.Refund or resendnew for any orders due to the product quality problem.
2.We accept any unused itemin its original package as return within 7 days of delivery. Buyers must provide the tracking number, specific reason forthe return.
3. if it's buyer' s reason lead to the return package, buyers need to pay for round shipping fare.
4. We will refund to buyer after we receive the returns in its original condition package. Or buyers could choose to have a replacement.
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